Department of Electro-Optical Engineering, NFUThe Internship Division of the Office of Research and Development is assisting in sharing this announcement. Please refer to the information below for details.
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Dear Students,
You are cordially invited to participate in the 2024 TSMC Equipment Excellence Innovation Exhibition! We sincerely look forward to your participation and believe your presence will make this event even more meaningful.
Innovation has always been the cornerstone of TSMC's growth. In addition to advancing semiconductor process technologies, TSMC continuously improves its manufacturing equipment and production processes to enhance operational efficiency and maintain its competitive advantage in manufacturing excellence. Each year, TSMC hosts the Equipment Excellence Innovation Exhibition as a platform for showcasing innovative equipment projects, exchanging technical knowledge, and celebrating the spirit of continuous improvement. Through this event, participants will gain a deeper understanding of TSMC's pursuit of excellence and its commitment to fostering employee innovation in equipment engineering.
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Event Highlights:
By joining the TSMC Equipment Excellence Innovation Exhibition, you will have the opportunity to:
1. Take a guided tour of TSMC wafer fabrication facilities (Hsinchu and Tainan) or the New Employee Training Center (Taichung).
2. Interact directly with TSMC equipment experts and experience the latest technologies.
3. Network with managers and alumni to explore career opportunities.
4. Discover how TSMC continuously pushes the limits of semiconductor manufacturing equipment to create greater value.
Eligible Participants:
Junior-year students and above majoring in Power Mechanical Engineering, Mechanical Engineering, Materials Strength, Electrical Engineering, Electronics Engineering, Mechatronics Engineering, Bio-Mechatronics Engineering, Aerospace Engineering, Automatic Control, Automation Engineering, Vehicle Engineering, Aeronautical Engineering, Refrigeration and Air Conditioning Engineering, Marine Engineering, Precision System Design, Precision Engineering, Mold Engineering, students enrolled in semiconductor programs, and other science and engineering disciplines (such as Optoelectronics, Materials Science, Engineering Science, etc.).
All undergraduate students in their third year or above are welcome to register and explore the exciting opportunities available in TSMC's equipment engineering field.
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:::: Event Sessions ::::
Hsinchu Session
• Tuesday, November 12, 2024 | 14:00–17:00
• Wednesday, November 13, 2024 | 14:00–17:00
• Thursday, November 14, 2024 | 09:30–12:30
Hsinchu Registration: https://bit.ly/4e7z4Iu
Taichung Session
• Tuesday, November 19, 2024 | 14:00–17:00
• Wednesday, November 20, 2024 | 14:00–17:00
• Thursday, November 21, 2024 | 09:30–12:30
Taichung Registration: https://bit.ly/4eb4GNy
Tainan Session
• Tuesday, November 26, 2024 | 14:00–17:00
• Wednesday, November 27, 2024 | 14:00–17:00
• Thursday, November 28, 2024 | 09:30–12:30
Tainan Registration: https://bit.ly/3XCas3r
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Registration Deadline: From now until Sunday, October 13, 2024. Seats are limited.
Participation Fee: Free of charge (including shuttle transportation, travel insurance, and complimentary refreshments after the event).
Important Notes:
This event involves extensive walking. Please consider your physical condition before registering. If you have any special needs, please feel free to contact the organizer in advance.
Participants are encouraged to register for the session closest to their university. For safety reasons, all participants must travel as a group. Individual transportation to the venue is not permitted. TSMC will arrange shuttle buses departing from designated locations at participating universities. Shuttle information will be provided approximately one week before the event.
We look forward to welcoming you to this inspiring event. Should you have any questions, please do not hesitate to contact us.
TSMC Talent Development & Recruitment Division – Talent Incubation Team
Contact: Mr. Chen
Email: HCCHERN@tsmc.com
Business Mobile: +886-978-211-692
